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半導體

SiC/GaN晶圓刻印裝置

SiC/GaN晶圓刻印裝置

深紫外光雷射晶圓刻印
Deep UV Laser Marking Unit
可刻印多種材質材料

※特別適合SiC、GaN、聚醯亞胺等透明難以加工材料。
Best marking solution for Transparent wafers, like SiC/GaN/LN/LT,etc.

晶片/晶圓兩種刻印方式皆可對應
Both Wafer ID and Chip ID marking available.

熱影響低和粉塵量少實現完成高品質刻印
Very few contamination and thermal damage.

製程

應用

Wafer ID MarkingChip ID Marking
Characters
Wafer ID Marking:Characters

Data-Matrix
Wafer ID Marking:Data-Matrix
Characters
Chip ID Marking:Characters

Data-Matrix
Chip ID Marking:Data-Matrix

優點

Wavelength:266nm

 


LT


LN


SiC

 


GaN

規格

ModelWLM-4600-IWLM-4600-C
PurposeWafer ID MarkingChip ID Marking
Wavelength of Laser266nm
Wafer Size~200mm
LoaderOpen Cassette(2Ports)
Font CharacterSEMI M12/M13Our Original small font
Marking SideOn the Top
Accuracyr:<±0.25mm
θ:<±0.5mm
<±0.10mm
Throughput50WPH
*Depends on number of chips in wafer
20WPH
Size1402mm(W)×1750mm(D)×2062mm(H)1400mm(W)x2700mm(D)x2062mm(H)
Weight1300kg2000kg
Power Supply3-phase 200V ± 10% 30A
VacuumPressure:<-75kPa, Flow:>50 NL/min
Pressured AirDew point:-15 @sub atmospheric-pressure
Pressure:>0.5 MPa, Flow:>50 NL/min
OptionsBackside Marking, 2D-Code Marking, Online communication,
Dust Collector, OCR/2D-Code Reader

WLM-4600-I

WLM-4600-C

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台湾鷹野股份有限公司(桃園事務所)
TEL:03-3413-882